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Innovation is the driving force for the sustainable development of PCB industry

2020-01-14

When companies rely on imitation and production development to a certain extent, if there is no innovation, enterprise development bottleneck will appear, if not break through the bottleneck, having been knocked out by industry may be at risk from Waterloo until, at present a lot of PCB factory in this no innovation, to breakthrough, then PCB enterprise innovation from the aspects of which broken?

 

First, innovation in PCB products and markets.

The innovation of the printed circuits is based on technological innovation. The noise printed electronic circuit (PEC) has revolutionized PCB products and processes.

The printed circuit board (PCB) has become an indispensable part of modern electronic equipment. No matter it is the high-end electronic equipment in the sky or in the sea, or household appliances and electronic toys, it is necessary to load the PCB with electronic components and electrical signals, and PCB is developed with the development of the whole electronic information industry.

Printed circuit innovation, first lies in the PCB product and market innovation. The earliest PCB products were single-panel, insulated boards with a single layer of conductor and line widths in millimeters, which were commercially used in semiconductor (transistor) radios. Later, with the advent of TV sets and computers, PCB products have been innovated with the emergence of double panels, multi-layer boards, two or more layers of conductors on the insulation board, and the line width has been gradually reduced. In order to adapt to the miniaturization and lightweight development of electronic equipment, flexible PCB and rigid-flexible combined PCB appeared.

At present, PCB's main market is in the fields of computers (computers and peripherals), communication equipment (base stations and handheld terminals, etc.), home electronics (televisions, cameras, game consoles, etc.) and automotive electronics, etc. PCB products are mainly multi-layer boards and high-density interconnect (HDI) boards. Along with the computer to the high-speed and large capacity, the mobile phone to the multifunctional intelligent, TV to high-definition 3 d, cars to develop in the direction of high-security intelligence, HDI PCB also shift from wire connection to electronic circuit function, namely the PCB products in addition to the basic of conductor line, also includes passive components such as resistors, capacitors and active components such as IC chip. The new generation of HDI boards is embedded component boards containing components.The newer generation of PCB is suitable for high frequency and high-speed signal transmission applications. The PCB layer will contain optical fiber and waveguide, forming a photoelectric PCB suitable for signal transmission over 40GHz.

Because of the continuous innovation of PCB products, we usher in the development of printed circuit one after another spring. Smartphones bring a surge of embedded component printed boards, LED energy-saving lighting brings a surge of metal-based printed boards, and electronic books and thin-film displays bring a surge of flexible circuit boards.

 

The innovation of PCB is based on technological innovation.

The traditional technology of PCB manufacturing is copper foil etching (subtracting method), that is, copper foil insulating substrate is etched by chemical solution to remove the unwanted copper layer, leaving the required copper conductor to form the circuit pattern; Interlayer interconnections for double-sided and multilayer plates are conducted by drilling and plating copper At present, this traditional process is difficult to adapt to the production of micron-scale HDI board, difficult to achieve rapid and low-cost production, and difficult to achieve the goal of energy conservation, emission reduction, and green production. Only technological innovation can change this situation.

High density is the eternal theme of PCB technology. High density is characterized by thinner lines, smaller interconnect holes, a higher number of floors, and greater thinness. For example, the line width/line spacing of PCB has been refined from 100 cm to 75 cm and 50 cm and will be refined to 25 cm and 20 cm in a few years. Therefore, it is necessary to reform and innovate the copper foil etching process. 

For the technical innovation of printed circuit, people have been pursuing the semi-addition method and addition method technology, that is, depositing copper layer in the insulation substrate to form the circuit pattern, which is an improvement on the traditional subtracting method, although there is progress, it still needs a lot of energy, and the cost is also high.The new innovation was the printed electronic circuit (PEC), which revolutionized PCB products and processes. Printed electronic circuit technology USES the pure printing method to achieve electronic circuit graphics, that is, the use of screen printing or offset printing or inkjet printing process, functional ink (conductive ink, semiconductor ink, insulating ink, etc.) printed on the insulation substrate, to obtain the required electronic circuit. This technology can simplify the production process, save raw materials, reduce pollutants, reduce production costs if equipped with Roll to Roll processing equipment, can achieve more large-scale, low-cost production.

The development of printed electronic circuit technology will bring the pcb board manufacturer to a higher level.

 

Management and operational innovation

The innovation of management and operation includes vertical integration of enterprise resources upstream and downstream or horizontal integration of complementary advantages among similar enterprises. The m&a behaviors of listed enterprises in recent years are such innovative measures.

Can also internal contracting related processes give technology proficient in supplier management also can yet be regarded as a kind of transferring risks mutually beneficial and win-win innovation model, such as some small businesses will be contracted to electroplating process of Jiangxi potion vendor management, both to reduce the investment risk, also can solve the problem of production capacity, oneself can release more energy on other good processes, the enterprise only establish a half a year has paid off equipment.

 

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