Demand in Seven Fields Drives PCB Growth

PCB provides interconnection and signal transmission between electronic products. It is a key interconnection part for assembling electronic parts. It not only provides electrical connection for electronic components, but also carries the business functions of digital and analog signal transmission, power supply, RF and microwave signal transmission and reception of electronic equipment. Most electronic equipment and products need to be equipped.

PCB manufacturing quality not only directly affects the reliability of electronic products, but also affects the integrity of signal transmission between chips.

The Demand of Seven Fields Drives the Growth of PCB

The terminal demand of PCB and printed circuit board assembly can be divided into enterprise level user demand and individual consumer demand. Among them, the demand of enterprise level users is mainly concentrated in the fields of communication equipment, industrial control medicine, aerospace and so on. The related PCB products are often characterized by high reliability, long service life, strong traceability and so on. The qualification certification of corresponding PCB enterprises and pcb board manufacturer is more strict and the certification cycle is longer. The demand of individual consumers is mainly concentrated in the fields of computer, mobile terminal and consumer electronics, and the related PCB products. The products usually have the characteristics of light, miniaturization, bendability and so on made in PCB factory. The terminal demand is large, and the corresponding PCB enterprises and China PCB manufacturer are required to have the ability to supply in large quantities.

Figure 1: Downstream Application of PCB

PCB is Developing Towards "Light, Thin, Short and Small"

PCB linewidth evolves towards smaller size and higher integration. Especially with the increasing functions of smart electronic terminals such as mobile phones, the number of I / O becomes more and more, and the line width and line spacing must be further reduced; however, traditional HDI is limited by the manufacturing process, which is difficult to meet the requirements, and SLP (substract like PCB) technology, which has more stack layers, smaller line width and line spacing, and can carry more functional modules, becomes an inevitable choice to solve this problem.

Figure 2: Progress of Technical Tndicators of Mobile Terminal PCB

SLP has a smaller linewidth than HDI. SLP is a high-level HDI, which mainly uses the semi addition technology. It is a PCB graphic production technology between the subtraction method and the full addition method. The production technology is more mature than the full addition method, and the precision and reliability of the graphics can meet the needs of high-end products, which can be produced in batches. The semi addition process is suitable for making fine linewidth line spacing between 10 / 10-50 / 50 μ M. As an optimized product that can meet the requirements of mobile space and signal transmission at the same time, the gradual mass production and promotion of SLP will break the industry ecology.