[Enterprise Hotspot] China's First Semiconductor Laser Invisible Wafer Cutting Machine is Successfully Developed

On May 18, Great Wall official micro said that China's first semiconductor laser invisible wafer cutting machine was successfully developed recently, filling in the domestic gap and taking the lead in key performance parameters in the world. China's semiconductor laser stealth wafer cutting technology has made a substantial breakthrough, and the dependence of related equipment on imports will be broken.

According to the report, by using special materials, special structure design and special motion platform, China PCB manufacturer, the equipment can maintain high stability and high precision when the processing platform moves at high speed, with the movement speed up to 500mm / s and the efficiency far higher than that of foreign equipment. In the aspect of optics, according to the spectral characteristics of monocrystalline silicon, combined with the application level of industrial laser, the laser with suitable wavelength, total power, pulse width and repetition frequency is adopted, and finally the invisible cutting is realized.

This is a year long joint research and development success of Zhengzhou rail transit Institute and Henan GM. Zhengzhou rail transit Institute was established in 2017 and then acquired by the great wall of China. It has been focusing on independent safety industrial controller, high-end equipment manufacturing and new generation information technology breakthrough to carry out scientific research innovation and technological breakthrough.

China's domestic substitution and independent control are still the most concerned topics at present. It is reported that IC insights, a well-known global semiconductor market research institution, released the performance of wafer manufacturing market in major countries and regions in 2019, of which China is the only one growing. Specifically, in 2019, the scale of China's wafer manufacturing market was US $11.357 billion, up 6% year-on-year; that of America was US $30.813 billion, down 2% year-on-year; that of Europe was US $3.595 billion, down 11% year-on-year; that of Japan was US $2.987 billion, down 13% year-on-year. IC insights believes that in the past 10 years, with the increase in the number of Chinese chip design companies (such as Huawei Hisilicon), the demand for wafer manufacturing has increased accordingly.

Great wall of China also announced its latest performance in the near future, with revenue of 10.844 billion yuan in 2019, a year-on-year growth of 8.34%, and non net profit deduction of 490 million yuan, a year-on-year growth of 40.17%. In the first quarter of 2020, the revenue was 1.120 billion, a year-on-year decrease of 41.64%, and the loss of non net profit was 259 million, a year-on-year increase of 645.25%.