Rigid-flexible

Layers:               8
Thicknes:             2.0±0.2mm
Min. Hole Size:       0.3mm
Width/Space:          0.121mm/0.152mm
Surface Treatment:    ENIG

• Parameters

Large Panel Lamination
Air-gap Structure

• Crafts

Industry control

• Applications

Layers:  4L (1R+2F+1R)

Thicknes:  0.65±0.10 mm

Min. Hole Size: 0.30 mm

Width/Space:  0.15 mm/0.12 mm

Surface Treatment: ENIG

• Parameters

Black Ink

Rigid - flexible Board

• Crafts

Consumer electronics

• Applications

• Parameters

• Layers: 20

• Thicknes:  1.5 ±0.15mm

• Surface Treatment:    ENIG

•  

• Crafts

• Impedance

• Pressfit Hole

• Counterbore

•  

• Applications

• Industry control

Layers:    18L (4R+10F+4R)

Thicknes:    2.1±0.02mm

Size:    287.88*421.05mm

Min. Distance Between Line and Width:    0.2mm/0.2mm

Min. Buried Via/PAD:    0.4mm/1.0mm

Min. Distance from Via to Line:    0.3mm

Thickness:  Surface Copper≥35um; Min. Hole Copper:  30um;  Average: 35um

Impedance:    50±10%

Surface Treatment:  ENIG

• Parameters

ARLON PI Material Special Control during Lamination

Impedance Control

Mechanical Depth Routing Control

Protecting Adhesive Covering Connection Conner between Flex and Rigid Tech

Laser Depth Cutting Control

• Crafts

Mother Board of Aerial Tanker Control System

• Applications

Power Electronics

• Parameters

• Layers:             12L（4R+4F+4R）

• Thicknes:           1.50 ±0.15mm

• Min. Hole Size:      0.18mm

• Width/Space:        0.08mm/0.12mm

• Surface Treatment:    ENIG

• Crafts

• Applications