HDI

整板电金板B

 


 

28层HDIB

 

 

  • Layers:12L
    Thicknes:0.96mm
    Size:93.98mm X 93.98mm

    Step:2 Step HDI

    Surface TreatmentENIPIG

    blind via

    Medical

    • Parameters

    • Crafts

    • Applications

    Layers: 28L

    Thickness:2.983mm±0.28mm

    Size:297.98mm×339.98mm

    Minimum Line Width/Clearance:0.1mm/0.1mm

    nimum Clearance between Inner Layer PTH and Line:0.175mm 

    Surface treatment:

    three steps bidirectionnal adding layer stacked-type blind via and buried hole laser HDI
    multiple lamination and interlamination counterpoint
    electriplating filling

    • Parameters

    • Crafts

 

 

4阶HDIb

 

 

 

  • Layers:16L
    Thicknes: 1.82 ±0.18mm
    Width/Space:  0.1mm/0.1mm
    Min. Hole Size:0.1mm
    Surface Treatment:Immersion Silver

    Step Slot

    Inner Glod finger

    2Steps HDI Board

    Computer

    • Parameters

    • Crafts

    • Applications

    Layers:    14L(4+6+4)

    Thicknes:   1.64±0.164mm

    Min. Hole Size:    0.10mm

    Width/Space:    0.08mm/0.1mm

    Surface Treatment:   ENIG

     

    Four step unidirectional layer added and stack-up laser holes HDI

    Multi-lamination and layer alignment technology

     

    Communications satellite

    黑油阶梯HDI板B

    • Parameters

    • Crafts

    • Applications

    Layers:  8

    Thicknes: 4.25mm±0.25mm

    Size:  142.44mm×123.06mm

    Min. Hole Size:    0.7mm

    Width/Space:   0.1mm/0.127mm

    Surface Treatment:    ENIG

    Asymmetrical Mechanical Two-Step Stair-Like HDI

    No-Flow Pp Lamination

    Step-Like Board Manufacture

    Screwed Hole Process

     

    Industry control

    • Parameters

    • Crafts

    • Applications

 

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