Multilayer
Layers: 18
Thicknes: 3.66+0.20/-0.3 mm
Size:462mm×614 mm
Width/Space: 0.28 mm/0.1 mm
Surface Treatment: ENIG
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Parameters
Characteristic Impedance 50±5Ω;
2OZ Heavy Copper
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Crafts
Communication
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Applications
Layers: 36
Thicknes: 8.0±0.8mm
Min. Hole Size: 0.508mm
Width/Space: 0.381mm/0.18mm
Surface Treatment: ENIG
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Parameters
INNER LAYER 4OZ
ASPECT RATIO 16:1
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Crafts
Communication
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Applications
Layers: 32
Minimum Line Width/Clearance:0.068mm/0.106mm
Minimum Clearance between Inner Layer PTH and Line: 0.508mm
Minimum back drilling diameter: 0.20mm
Board Thickness:4.415+0.46/-0.42mm
Size:282mm×750mm
Aspect Ratio:22
Surface treatment:OSP
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Parameters
Special Process:Single-sided impedance 54Ω±10%, Differentialimpedance 93+7/-8Ω
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Crafts
Communication
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Applications
Layers: 20
Thicknes: 5.55±0.4mm
Size:477mm×516.5mm
Width/Space:0.145mm/0.12mm
Surface Treatment: ENIG
L8-L9,L10-L11, L12-L13 use IT180Aand they’re 3OZ heavy copper, other layers use R5775.
Communication
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Parameters
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Crafts
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Applications