Multilayer

Layers:  18

Thicknes: 3.66+0.20/-0.3 mm

Size：462mm×614 mm

Width/Space: 0.28 mm/0.1 mm

Surface Treatment: ENIG

• Parameters

Characteristic Impedance 50±5Ω；

2OZ Heavy Copper

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Communication

• Applications

Layers:  36 

Thicknes:  8.0±0.8mm

Min. Hole Size:  0.508mm

Width/Space: 0.381mm/0.18mm

Surface Treatment: ENIG

• Parameters

INNER LAYER 4OZ

ASPECT RATIO 16:1

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Communication

• Applications

Layers:  32

Minimum Line Width/Clearance：0.068mm/0.106mm

Minimum Clearance between Inner Layer PTH and Line： 0.508mm

Minimum back drilling  diameter： 0.20mm

Board Thickness：4.415+0.46/-0.42mm

Size：282mm×750mm

Aspect Ratio：22

Surface treatment：OSP

• Parameters

Special Process：Single-sided impedance 54Ω±10%, Differentialimpedance 93+7/-8Ω

• Crafts

Communication

• Applications

Layers:  20

Thicknes: 5.55±0.4mm

Size：477mm×516.5mm

Width/Space:0.145mm/0.12mm

Surface Treatment: ENIG

L8-L9,L10-L11, L12-L13 use IT180Aand they’re 3OZ heavy copper, other layers use R5775.

Communication

• Parameters

• Crafts

• Applications